For the past 27 years, Faa-Ching Wang, Ph.D. has made exemplary
contributions to the engineering profession and semiconductor industry.
As Manager of Texas Instruments’ (TI) worldwide printer head business
unit, Faa-Ching is currently responsible for the general worldwide
management of the company’s printer head integrated circuit business
group. His responsibilities cover the full scope of business activities
from marketing, customer relationships and new technology/product
development to factory manufacturing operation and supply chain
management of six factories located around the world.|
Some of Faa-Ching’s most significant professional contributions include:
• Contributing to the advancement of modern Si integrated circuit wafer
manufacturing technology on industry-recognized factory start-up/ramp-up
copy exact methodology, high volume/yield low-cost factory operation,
and process development of 3.5 advanced technology nodes.
• Contributing to and commercializing the major advancement of
high-speed (Ghz range) integrated circuits and energy conversion devices
of compound semiconductor with significantly improved material
preparation, characterization, and device processing techniques.
• Innovating and demonstrating a new business model leveraging small
company practices on a large company platform.
Faa-Ching holds four U.S. patents and three invention disclosures, and
is the author of 39 articles published in a variety of technical
publications. He is the recipient of several professional and community
In 1989, Faa-Ching founded the Dallas/Ft. Worth (DFW) chapter of the
Chinese Institute of Engineering/USA (CIE/DFW). CIE/DFW is currently the
largest and most recognized Asian professional organization in Texas.
In addition to his work for CIE/USA, Faa-Ching served as a Board of
Director for the Asian American Citizen Council (AACC) in Dallas from
1999-2001. He is a long-time, avid supporter of the United Way and
Juvenile Diabetes Research Foundation (JDRF).
Faa-Ching earned his Ph.D. in Materials Science and Engineering from
Stanford University. He received a Master’s degree in Physics from the
University of Pittsburgh and a Bachelor’s degree in Physics from
National Central University in Taiwan.